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產品介紹

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無鹵柔性覆銅板

Product introduction- Epoxy Resin PI Film Based FCCL
無鹵柔性覆銅板

產品介紹 - 無鹵柔性覆銅板

Product introduction- Epoxy Resin PI Film Based FCCL
軟性覆銅箔基板(FCCL)是由銅箔、膠粘劑、PI膜三種材料經高精密塗布技術複合而成。具有耐高溫、高絕緣、高撓曲等特性。廣泛應用於FPC製造。

Epoxy resin PI film based FCCL is composed of three kinds of materials, copper foil, adhesive and PI film, which are compounded by high precision coating technology. With high temperature resistance, high insulation, high flexibility and other characteristics. Widely used in FPC manufacturing.



·產品結構及係列Product Structure and Series

產品結構 Product structure

產品係列 Product serides

銅箔 Copper Foil
環氧樹脂 Adhesive
Pi膜 PI Film
單麵基板 Single-side FCCL
銅箔 Copper Foil
環氧樹脂 Adhesive
Pi膜 PI Film
環氧樹脂 Adhesive
銅箔 Copper Foil
雙麵基板 Double-side FCCL

高撓曲係列
  High flexural series

LED   係列
  LED series

BGA係列
  BGA series


 

·產品規格 Product Specifications

Item(項目)

Test method(測試方法)

Specification(規格)

Width(幅寬)

Specification

250±1mm

Polyimide   thickness(PI厚度)

Specification

12.5um、25um

Adhesive   thickness(膠層厚度)

Specification

13-25um

Copper   thickness(銅箔厚度)

Specification

12.5um、18um、35um

Shelf   life(保質期)

25±10℃,65±20﹪RH

12months

 

 

·產品性能 Product Properties

Item(項目)

Test method(測試方法)

Specification(規格)

Peel   strength

(剝離強度)

As   Received(直接測試)

IPC   TM650 2.4.9

≧0.8kgf/cm

After    MEK/10min

(丁酮浸泡10分鍾測試)

≧0.8kgf/cm

Solder   Float Resistance(耐焊性)

(after   165℃±5℃ 1hr)                   ( 165℃±5℃烘烤1小時後)

IPC   TM650 2.4.13

288℃ 10sec

Dimensional   stability(尺寸穩定性)

IPC   TM650 2.2.4

TD≦±0.2%

MD≦±0.2%

Chemical   resistance

(耐化學品性)

MEK   5min(丁酮浸泡5分鍾測試)

IPC   TM650 2.3.2

No   evident of defects

HCl   5% 5min(5%鹽酸溶液浸泡5分鍾測試)

NaOH   5% 5min(5%氫氧化鈉溶液浸泡5分鍾測試)

Surface   Resistivity(Ω)(表麵電阻率)

IPC   TM650 2.5.17

≧1.0*1013Ω

Volume   Resistivity(Ω.cm)(體積電阻率)

IPC   TM650 2.5.17

≧1.0*1015Ω.cm

Insulation   Resistance(Ω)(感應電阻率)

IPC   TM650 2.6.3.2

≧1.0*1011Ω






  

·產品應用  Product Application

該係列產品廣泛應用於FPC製造。

This series of products are widely used in FPC manufacturing.