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產品介紹

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無鹵PI補強

Product introduction- Halogen free PI stifferner
無鹵PI補強

產品介紹 - 無鹵PI補強

Product introduction- Halogen free PI stifferner
PI補強板是用高耐熱、高粘著力的膠粘劑塗布在PI膜基材上製成,厚度 1mil 至 10mil。優良的熱貼合性質保證其對銅箔和PI等材料具有良好的附著性,廣泛應用於FPC的各種補強。

Halogen free PI reinforcing plate is made of high heat resistant and high adhesive adhesive coating on PI film substrate, and the thickness is from 1mil to 10mil. The excellent properties of heat bonded to ensure its good adhesion on copper foil and PI material, widely used in various FPC reinforcement.


 

·產品結構及係列Product Structure and Series

產品結構 Product structure

產品係列 Product serides


Pi膜 PI Film
環氧樹脂 Adhesive
離型紙 Release Paper



環氧膠係列 Epoxy series



·產品規格 Product Specifications

Item(項目)

Test method(測試方法)

Specification(規格)

Width(幅寬)

Specification

250±1mm

PI stifferner film thickness(PI厚度)

Specification

3-9 mil

Adhesive   thickness(膠層厚度)

Specification

25±3um

Shelf   life(保質期)

25±10℃,65±20﹪RH

12months

 

·產品性能 Product Properties

Item(項目)

Test method(測試方法)

Specification(規格)

Adhesive   flow(溢膠量)

IPC   TM650 2.3.17.1

≦0.2mm

Peel   strength

(剝離強度)

As   Received(直接測試)

IPC   TM650 2.4.9

≧0.8kgf/cm

After    MEK/10min

(丁酮浸泡10分鍾測試)

≧0.8kgf/cm

Solder   Float Resistance(耐焊性)

(after   165℃±5℃ 1hr)                   ( 165℃±5℃烘烤1小時後)

IPC   TM650 2.4.13

288℃ 10sec

Surface   Resistivity(Ω)(表麵電阻率)

Volume   Resistivity(Ω.cm)(體積電阻率)

IPC   TM650 2.5.17

IPC   TM650 2.5.17

≧1.0*1013Ω

≧1.0*1015Ω.cm

Insulation   Resistance(Ω)(感應電阻率)

IPC   TM650 2.6.3.2

≧1.0*1011Ω


 

·產品應用  Product Application

用於插拔金手指等部位補強。

The product is mainly used to reinforce parts such as gold finger.