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產品介紹

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可彎折鋁基板

Product introduction- Aluminum substrate
可彎折鋁基板

產品介紹 - 可彎折鋁基板

Product introduction- Aluminum substrate
可彎折鋁基板是一種具有良好散熱功能的金屬基覆銅板,鋁板厚度 0.1-0.2mm。優良的導熱性能保證了LED產品的快速散熱。該係列產品廣泛應用於LED燈具的製作。

Aluminum substrate is a kind of metal clad copper plate with good heat dissipation function. The thickness of aluminum plate is 0.1-0.2mm. The excellent thermal conductivity ensures the rapid cooling of LED products. This series of products are widely used in the manufacture of LED lamps.

·產品結構及係列  Product Structure and Series



產品結構 Product structure

產品係列 Product serides


銅箔 Copper Foil
環氧樹脂 Adhesive
Pi膜 PI Film
環氧樹脂 Adhesive
鋁箔 Al board



鋁基厚度0.1-02mm

Aluminum thickness 0.1-0.2mm



 

·產品規格 Product Specifications

Item(項目)

Test method(測試方法)

Specification(規格)

Width(幅寬)

Specification

250±1mm

Polyimide   thickness(PI厚度)

Specification

12.5um、25um

Adhesive   thickness(膠層厚度)

Specification

20±3um

Aluminum thickness(鋁箔厚度)

Specification

100-200um

Copper   thickness(銅箔厚度)

Specification

35um

Shelf life(保質期)

25±10℃,65±20﹪RH

12months

 

   

·產品性能 Product Properties

Item(項目)

Test method(測試方法)

Specification(規格)

Peel   strength(剝離強度)

As   Received

(直接測試)

IPC   TM650 2.4.9

≧1.5kgf/cm

After    MEK/10min      

  (丁酮浸泡10分鍾測試)

≧1.5kgf/cm

Solder   Float Resistance(耐焊性)

(after   165℃±5℃ 1hr)                    (165℃±5℃烘烤1小時後)

IPC   TM650 2.4.13

288℃ 10sec

Dimensional stability(尺寸穩定性)

IPC TM650 2.2.4

TD≦±0.2%

MD≦±0.2%

Chemical   resistance(耐化學品性)

MEK   5min(丁酮浸泡5分鍾測試)

IPC   TM650 2.3.2

No   evident of defects

Hcl   5% 5min (5%鹽酸溶液浸泡5分鍾測試)

NaOH   5% 5min (5%氫氧化鈉溶液浸泡5分鍾測試)

Surface   Resistivity(Ω)(表麵電阻率)

IPC   TM650 2.5.17

≧1.0*1013Ω

Volume   Resistivity(Ω.cm)                   (體積電阻率)

IPC   TM650 2.5.17

≧1.0*1015Ω.cm

Insulation   Resistance(Ω)

(感應電阻率)

IPC   TM650 2.6.3.2

≧1.0*1011Ω







·產品應用  Product Application

該係列產品廣泛應用於LED燈具的製作。

This series of products are widely used in the manufacture of LED lamps.